Intel Gelontorkan Dana 7 Miliar Dolar Untuk Proyek Pengemasan Semikonduktor di Malaysia

Intel Deploys 7 Billion Dollars to Invest in Semiconductor Packaging Project in Malaysia

Droidcops.COMWith the ongoing shortage of chipset supply crisis, Intel made many new strategic decisions to prevent something like this from happening again in the future.

Intel not only made new investments in the United States, but also developed many multi-national projects. Now Intel plans to spend $7 billion to develop their semiconductor packaging facility in Penang, Malaysia.

In May, Intel announced that it would spend approximately $3.5 billion on a packaging facility in Rio Rancho, Albuquerque, New Mexico. These packaging facilities are an important part of semiconductor manufacturing and design. This will not only affect the cost of producing the chip, but also affect the strength, performance and basic functionality of a chip at the micro level.

Intel is developing into a new packaging generation called Copper Hybrid Bonding Interconnect. It is used when chip dimensions are below 10 microns and will help provide a 10x increase in interconnect density.

Intel has previously stated that progress in a new generation of packaging technology is one of their targets to take over the industry leadership in manufacturing by 2025.

Intel will officially announce its expansion activities this week, at Kuala Lumpur airport which will be attended by Intel CEO Pat Gelsinger, Malaysian Trade Minister and Malaysian Development Authority CEO.

This investment will not only help Intel in developing state-of-the-art packaging facilities, but also helping it to protect itself from international relations and US economic policies. They do not deny that the increasingly fierce trade war between America and China has had an impact on Intel’s base line and their extraordinary expansion project in China.

Intel’s continued interest in these international facilities will ensure the independence of the company, and is also expected to be able to protect them from actions or policies or sanctions that may be imposed by US regulatory agencies.

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